晶圆研磨GNX200BP晶圆减薄Wafer Grinding
发布时间：2021-03-24 12:45:00 作者：衡鹏
晶圆研磨GNX200BP晶圆减薄Wafer Grinding
晶圆研磨GNX200BP晶圆减薄/Wafer Grinding概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stati*** are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 micr***.
晶圆研磨GNX200BP晶圆减薄Wafer Grinding相关产品：
衡鹏供应
GDM300晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding
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